Application Industries of Precision Laser Cutting Machine Processing Technology Focused on Thin Plates
Precision laser cutting machine processing technology, which focuses on thin plates, offers high processing precision, fast speed, and smooth, flat cutting edges—typically requiring no subsequent processing. It features a small heat-affected zone, minimal sheet deformation, high processing accuracy, excellent repeatability, and no damage to the material surface. Currently, precision processing is being applied in an increasing number of industries, including:
  • PCB board cutting;
  • Precision cutting of microelectronic circuit templates;
  • Eyewear industry;
  • Jewelry industry.

Characteristics of Laser Precision Processing

(1) Wide Application Range:
Laser precision processing can handle an extremely broad range of materials, including almost all metal and non-metal materials. It is suitable for material sintering, drilling, marking, cutting, welding, surface modification, and chemical vapor deposition, among other processes. In contrast:
  • Electrochemical machining can only process conductive materials;
  • Photochemical machining is only suitable for easily corrodible materials;
  • Plasma processing struggles with certain high-melting-point materials.
(2) High Precision and Refinement:
The laser beam can be focused into an extremely small spot, making it particularly suitable for precision processing. Laser precision processing is affected by fewer factors and achieves higher accuracy, generally outperforming other traditional processing methods.
(3) High Speed and Efficiency:
In terms of processing cycles:
  • EDM (Electrical Discharge Machining) requires high-precision tool electrodes with significant wear, resulting in longer processing cycles;
  • Electrochemical machining involves heavy design workload for cathodes used in cavity/shape processing, leading to long manufacturing cycles;
  • Photochemical machining involves complex procedures;
  • Laser precision processing, however, is easy to operate. The cutting seam width can be conveniently adjusted, enabling high-speed engraving and cutting based on computer-generated patterns. Its processing speed is fast, with a shorter cycle than other methods.
(4) Safety and Reliability:
Laser precision processing is a non-contact process that does not cause mechanical extrusion or stress on materials. Compared to EDM or plasma arc processing, its heat-affected zone and deformation are minimal, making it capable of processing extremely small components.
(5) Cost-Effectiveness:
It is not limited by processing volume. For small-batch processing services, laser processing is more economical. For large-scale product processing—where mold manufacturing costs are high—laser processing eliminates the need for any mold production. Additionally, it completely avoids edge collapse caused by material shearing, significantly reducing enterprise production costs and improving product quality.
(6) Small Cutting Seam:
The laser cutting seam is typically 0.1-0.2mm.
(7) Smooth Cutting Surface:
Laser-cut surfaces are burr-free.
(8) Minimal Thermal Deformation:
Laser processing features thin cutting seams, high speed, and concentrated energy, resulting in minimal heat transfer to the material and extremely small deformation.
(9) Material Savings:
Laser processing uses computer programming to nest products of different shapes, maximizing material utilization and significantly reducing enterprise material costs.
(10) Ideal for New Product Development:
Once product drawings are finalized, laser processing can be implemented immediately, enabling the production of physical prototypes of new products in the shortest possible time.


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